View MAX1973EUB_812363.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

MAX1973EUB Rev. A
RELIABILITY REPORT FOR MAX1973EUB PLASTIC ENCAPSULATED DEVICES
February 9, 2003
MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086
Written by
Reviewed by
Jim Pedicord Quality Assurance Reliability Lab Manager
Bryan J. Preeshl Quality Assurance Executive Director
Conclusion The MAX1973 successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim's continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim's quality and reliability standards. Table of Contents I. ........Device Description II. ........Manufacturing Information III. .......Packaging Information IV. .......Die Information V. ........Quality Assurance Information VI. .......Reliability Evaluation ......Attachments
I. Device Description A. General The MAX1973 is a constant-frequency 1.4MHz pulse-width-modulated (PWM) current-mode step-down regulator. The output voltage can be set as low as 0.75V using an external voltage-divider, or it can be set to preset outputs of 1V, 1.5V or 2.5V without requiring external resistors. The MAX1973 also includes a voltage-margining feature that offsets the output voltage up or down 4% to facilitate board-level production testing. A fixed 1.4MHz operating frequency ensures operation outside the DSL frequency band, provides fast transient response, and allows the use of small external components. Only 4.7F input and output ceramic capacitors are needed for 1A applications. Forced PWM operation ensures a constant switching frequency over all load conditions. Output voltage accuracy is 1% over load, line, and temperature operating ranges. The MAX1973 features voltage margining. The device is available in small 10-pin MAX package.
B. Absolute Maximum Ratings Item IN, POK, CTL1, CTL2, FBSEL, ON to GND COMP, FB, SS to GND PGND to GND LX Current (Note 1) Operating Temperature Range Storage Temperature Range Lead Temperature (soldering, 10s) Continuous Power Dissipation (TA = +70C) 10-Pin uMAX Derates above +70C 10-Pin uMAX Rating -0.3V to +6V -0.3V to (VIN + 0.3V) -0.3V to +0.3V -2.4A to +2.4A -40C to +85C -65C to +150C +300 444mW 5.6mW/C
. Note 1: LX has internal clamp diodes to IN and PGND. Applications that forward bias these diodes should take care not to exceedthe IC package power dissipation limit.
II. Manufacturing Information A. Description/Function: B. Process: C. Number of Device Transistors: D. Fabrication Location: E. Assembly Location: F. Date of Initial Production: Smallest 1A, 1.4MHz Step-Down Regulator S8 - Standard 8 micron silicon gate CMOS 1998 California, USA Philippines, Malaysia or Thailand July, 2002
III. Packaging Information A. Package Type: B. Lead Frame: C. Lead Finish: D. Die Attach: E. Bondwire: F. Mold Material: G. Assembly Diagram: H. Flammability Rating: I. 10-Lead uMAX Copper Solder Plate Silver-filled Epoxy Gold (1.3 mil dia.) Epoxy with silica filler Buildsheet # 05-3501-0031 Class UL94-V0
Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: Level 1
IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Metallization: E. Minimum Metal Width: F. Minimum Metal Spacing: G. Bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: 62 X 89 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide) TiW/ AlCu/ TiWN None .8 microns (as drawn) .8 microns (as drawn) 5 mil. Sq. SiO2 Wafer Saw
V. Quality Assurance Information A. Quality Assurance Contacts: Jim Pedicord (Reliability Lab Manager) Bryan Preeshl ( Executive Director of QA) Kenneth Huening (Vice President) B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 135C biased (static) life test are shown in Table 1. Using these results, the Failure Rate () is calculated as follows: = 1 = MTTF 1.83 (Chi square value for MTTF upper limit) 192 x 4389 x 90 x 2 Temperature Acceleration factor assuming an activation energy of 0.8eV = 12.07 x 10-9 = 12.07 F.I.T. (60% confidence level @ 25C)
This low failure rate represents data collected from Maxim's reliability qualification and monitor programs. Maxim also performs weekly Burn-In on samples from production to a ssure reliability of its processes. The reliability required for lots which receive a burn-in qualification is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece sample. Maxim performs failure analysis on rejects from lots exceeding this level. The Burn-In Schematic (Spec.# 06-5984) shows the static circuit used for this test. Maxim also performs 1000 hour life test monitors quarterly for each process. This data is published in the Product Reliability Report (RR-1M) located on the Maxim website at http://www.maxim-ic.com . B. Moisture Resistance Tests Maxim evaluates pressure pot stress from every assembly process during qualification of each new design. Pressure Pot testing must pass a 20% LTPD for acceptance. Additionally, industry standard 85C/85%RH or HAST tests are performed quarterly per device/package family. C. E.S.D. and Latch-Up Testing The PM27 die type has been found to have all pins able to withstand a transient pulse of 1500V, per MilStd-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device withstands a current of 250mA.
Table 1 Reliability Evaluation Test Results MAX1973EUB
TEST ITEM TEST CONDITION FAILURE IDENTIFICATION SAMPLE SIZE NUMBER OF FAILURES
Static Life Test (Note 1) Ta = 135C biased Time = 192 hrs. Moisture Testing (Note 2) Pressure Pot Ta = 121C P = 15 psi. RH= 100% Time = 168hrs. Ta = 85C RH = 85% Biased Time = 1000hrs.
DC Parameters & functionality
90
0
DC Parameters & functionality
77
0
85/85
DC Parameters & functionality
77
0
Mechanical Stress (Note 2) Temperature Cycle -65C/150C 1000 Cycles Method 1010 DC Parameters 77 0
Note 1: Life Test Data may represent plastic D.I.P. qualification lots. Note 2: Generic process/package data
Attachment #1 TABLE II. Pin combination to be tested. 1/ 2/
Terminal A (Each pin individually connected to terminal A with the other floating) 1. 2. All pins except VPS1 3/ All input and output pins
Terminal B (The common combination of all like-named pins connected to terminal B) All VPS1 pins All other input-output pins
1/ Table II is restated in narrative form in 3.4 below. 2/ No connects are not to be tested. 3/ Repeat pin combination I for each named Power supply and for ground (e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc). 3.4 a. b. Pin combinations to be tested. Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All pins except the one being tested and the ground pin(s) shall be open. Each pin individually connected to terminal A with respect to each different set of a combination of all named power supply pins (e.g., V , or V SS1 SS2 or V SS3 or V CC1 , or V CC2 ) connected to terminal B. All pins except the one being tested and the power supply pin or set of pins shall be open. Each input and each output individually connected to terminal A with respect to a combination of all the other input and output pins connected to terminal B. All pins except the input or output pin being tested and the combination of all the other input and output pins shall be open.
c.
TERMINAL C
R1 S1 R2
TERMINAL A REGULATED HIGH VOLTAGE SUPPLY
S2 C1
DUT SOCKET
SHORT CURRENT PROBE (NOTE 6)
TERMINAL B
R = 1.5k C = 100pf
Mil Std 883D Method 3015.7 Notice 8
TERMINAL D
ONCE PER SOCKET
ONCE PER BOARD
10 OHMS
1 10
1 OHM
2 9
+5V
10 K
3
8
4
7
10 K
5 6
10 OHMS
0.1 uF 0.1 uF 0.1 uF
DEVICES: MAX 1973/1974 PACKAGE: 10-uMAX MAX. EXPECTED CURRENT = 10mA
DOCUMENT I.D. 06-5984 REVISION B
DRAWN BY: TEK TAN NOTES:
MAXIM
TITLE: BI
Circuit (MAX1973/1974)
PAGE
2
OF 3

▲Up To Search▲

Price & Availability of MAX1973EUB

	To Download MAX1973EUB Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .